Industry
Semiconductor Equipment
Vacuum-grade and wafer-handling components machined with cleanliness discipline.
What slows this industry down
Semiconductor equipment is machining at its most unforgiving: on a vacuum sealing surface a single scratch is a virtual leak, and the drawing notes — cleanliness, no cross-seal tool marks, oil-free finishing — are harder than the dimensions. Wafer-handling end effectors live on 0.02–0.05 mm flatness, where a warped part is measured directly in yield. Contamination control extends to material handling itself, including Cu/Zn exclusion zones most shops have never managed. Fleets run for a decade or more, so suppliers must reproduce alpha-build parts as spares years later, from controlled revisions.
Typical parts we machine
- Vacuum chamber bodies, lids and flanges
- Wafer-handling end effectors and edge grips
- Stage, gantry and motion-platform hardware
- Gas-delivery manifolds and substrate blocks
- PEEK/PTFE wafer-contact components
Recommended materials
MIC-6 Cast Aluminum Plate
The flatness specialist: stress-relieved cast plate that will not move when you machine it.
Stainless Steel 316L
Marine and medical stainless: molybdenum chemistry that shrugs off chlorides and sterilization cycles.
Aluminum 6061-T6
The default CNC aluminum: strong enough for most jobs, machines fast, anodizes well.
PEEK
The polymer that replaces metal: 250 °C service, chemical immunity, implant-grade options.
PTFE (Teflon)
The slipperiest solid known: seals and insulators immune to chemistry and heat alike.
Recommended finishes
Electropolishing
Reverse plating that brightens, deburrs and passivates stainless in one step.
Passivation
Chemical hygiene for stainless: strips embedded iron so the steel can be as stainless as advertised.
Anodizing Type II (Clear)
The standard aluminum finish: hard, clear oxide that keeps the metallic look.
Certifications & standards
- ISO 9001
- We understand semiconductor OEM supplier audits start at ISO 9001 process discipline and extend into cleanliness and handling procedures.
- EN 10204 3.1
- We support material traceability with EN 10204 3.1 mill certificates for vacuum and gas-path components where alloy chemistry matters.
- RoHS / REACH
- We support RoHS/REACH declarations for equipment modules shipping into regulated markets.
We understand and support these requirements; certification and documentation scope is confirmed per order.
Relevant services
CNC Milling
3- and 4-axis vertical machining for housings, brackets, manifolds and structural parts.
5-Axis Machining
Simultaneous 5-axis machining for impellers, freeform surfaces and compound-angle features.
Micro Machining
High-speed spindles and Ø0.1 mm tooling for features below 1 mm and watch-scale parts.
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